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TH-3019 Solder Paste, Sn99/Ag0.3/Cu0.7 High Temperature Solder Paste, 217℃ Melting Point, No Clean Lead Free Soldering Paste, Solder Paste for Electronics (5MLx4Pack)
4.3 (36 items)
Limited Time SaleUntil the end
18
18
44
$11.39 cheaper than the new price!!
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New $18.99
Product details
| Management number | 219035274 | Release Date | 2026/05/03 | List Price | $7.60 | Model Number | 219035274 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7% / Flux11.2%.
- High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
- Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
- Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
- Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
- Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.
| Style | Solder Paste-64g |
|---|---|
| Item Weight | 1.76 ounces |
| Manufacturer | TANG HONG |
| Power Source | hand_powered |
| Item model number | TH-3019 |
| Batteries Included | No |
| Batteries Required | No |
| Product Dimensions | 3 x 1 x 1 inches |
| Included Components | Needle*12, Push rod*4, Solder Paste*4 |
| Item Package Quantity | 1 |
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